High-performance Thermal Management & Interface Material Solution

We provide Thermal Interface Material with through-plane up to 90W/mK and in-plane up to 1,000W/mK that improves cooling capacity by reducing heat loss.

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With the increasing processing speeds and power requirements of modern electronic devices, greater amounts of heat are generated. Efficient and effective thermal management is essential to ensure optimal performance and long-term reliability of these devices.

Three main categories of TIM:
▪ Thermal Conductive Film
▪ Thermal Conductive Paste
▪ Thermal Conductive Adhesive

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