High-performance Thermal Management & Interface Material Solution

We provide Thermal Interface Material with through-plane up to 75W/mK and in-plane up to 1,950W/mK that improves cooling capacity by reducing heat loss.


With demands of higher processing speed & power in many electronic devices, more heat will be generated. Removing heat effectively & efficiently is important to maintain the performance of the electronics devices.

Three main categories of TIM:
▪ Thermal Conductive Film
▪ Thermal Conductive Paste
▪ Thermal Conductive Adhesive



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