CTP-300 is a carbon fiber thermal pad, which is highly flexible & has high thermal conductivity in the vertical (z-plane) direction. The material is made of silicone resin with highly-oriented carbon fiber. This material is highly flexible with good compression ratio to allow better compliance to unevenness to any surfaces. It can also be customized into different shapes and sizes based on the requirements of the application. The thermally conductive pads base on silicone and a special filler significantly exceeds the generic and performance Pads. Due to its low hardness and high compressibility the thermal pad is perfect for filling gaps. Our thermal pad contains no metallic elements is electrically isolating and it is not capable of moving objects. The handling is safe as direct exposure to any electrical data will not result in any damage. The handling of the Pad is safe for everyone. The common heat transfer terminology and definitions for TIM material. A heat transfer capacity between a hot and cold substrate is governed by the thermal resistances of the bonding TIMs. The thermal impedance of the TIM is a reflection of two properties, the ability to transfer heat between discrete interfaces of the substrates and the bulk thermal resistance. The conductivity and interfacial impedance can be determined based on measurement of the thermal impedance over a series of TIM. Features. Excellent thermal conductivity in the vertical z-plane (15 – 35 W/mK) Good flexibility & compression ratio. Environmentally friendly, does not contain any toxic ingredients. Flexible and can be easily bent and trim to customized sizes. Thin and lightweight. Heat resistant up to 150°C. RoHS compliant. Areas of Application. Semiconductor device testing, e.g. CPU, GPU, MCM, etc. Mobile phones & PC tablets, PCs, Servers, and cloud storage PDP, LED devices, IGBT Modules. Optical communications equipment, medical equipment. Specifications.