STP-400 series is a very cost-effective thermal interface material, which is soft, flexible and has its self-microtack properties. The material is made of silicone resin with proprietary interface conductive filler. This material is highly flexible with good compression ratio to allow better compliance for unevenness to any surfaces. There are options of non-silicone material which has high dielectric strength at high temperature. The material has a natural sticky tack effect, which is easy to install and can be reused. It can also be customized into different shapes and sizes based on the requirements of the application. Features. Excellent thermal conductivity in the vertical z-plane (3 – 8 W/mK) Good flexibility & compression ratio. Environmentally friendly, does not contain any toxic ingredients. Flexible and can be easily bent and trim to customized sizes. Thin and lightweight. Heat resistant up to 200°C RoHS compliant. Areas of Application. Semiconductor device testing, e.g. CPU, GPU, MCM, etc. Mobile phones & PC tablets, PCs, Servers, and cloud storage. PDP, LED devices, IGBT Modules. Optical communications equipment, medical equipment. Specifications.