Liquid Metal Thermal Paste

Liquid metal closeup photo

LVM-700 Series is a liquid metal thermal paste (thermal interface material), which is a chemical combination of gallium-indium-tin alloy. The material has a boiling point up to 2,000°C with very stable physical and chemical properties, making it non-volatile in air. It is a viscous thermal compound with 100% metal content and has good thermal conductivity in the vertical (z-plane) direction. It is able to fill up any possible air gap between 2 compressed surfaces and obtaining high temperature performance. This material has good wettability and adhesion with higher temperature resistance properties. It is stable in liquid state at low temperature and will remain in its state when subjected to high temperature.

Liquid metal thermal paste are designed to reduce microscopic air gaps between the surface of the cooler and the CPU’s integrated heat spreader. Liquid metal thermal paste can be electrically conductive or non-conductive. The liquid metal compounds need a greater concentration and attention when applied. Several budget pastes actually come closer to or outperform their more expensive rival.
Liquid metal fills the gaps between CPU/ GPU and heat sinks between them. Gallium has a high boiling point and a low melting point. For this reason, it remains as solid at room temperature. It cannot be used with aluminium heat sinks as the Gallium reacts with the aluminium. However, it can conduct a significant lower amount of heat than other metals such as Indium that are nonreactive to its liquid phase. The alloy’s liquid form makes use difficult. This means being careful not to drop fluid that can cause short term problems including component failure.

Liquid metal thermal paste ingredients

Liquid metal thermal paste is a mix of alloys which are called Galinstan. Major mixtures include indium, tritium and ion. This mixture with a wicked low melting point of around 21 °C is what makes spreading easy. Liquid metal thermal paste manufacturers are using a different “sauce” to manufacture what they feel is the most effective mixtures to cool you up on your GPU/computer.

Liquid Metal Thermal Paste effectiveness

Liquid metal thermal paste compounds are able to top this temperature chart with slightly colder values than traditional pastes. Most good thermal compounds perform very similar, but can vary enormously in the price per gram. Not every system will ever require the most expensive compound, so even the most expensive system builders can relax knowing even cheaper paste can still prove very effective. Thermal Compounds are often compared and questioned but the simple fact remains: PC system building needs thermal compounds to dissipate efficiently thermal loads.

The difference between liquid metal and thermal paste

Heat controls in the PC play vital parts in the performance of that product that can cause bottleneck, lagging and eventually cause malfunction in the computer’s components. They both act similar and are used for the same purpose. The differentiation between typical thermal paste and liquid metal is between the two types pros and cons before purchasing a thermal paste suited for their specific needs. Same types of paste is utilized to increase the heat management between a CPU, GPU and its heat sink.
Liquid metal has up to 73 W / (mK) thermal conductivity. Thermal paste cannot transmit as much heat as solid metal. All liquids are usually electroconductive which sometimes leads to a problem down the line. 

Features

  • Excellent thermal conductivity in the vertical z-plane (40 – 70 W/mK)
  • Good flexibility & compression ratio
  • Environmentally friendly, does not contain any toxic ingredients
  • Flexible and can be easily bent and trim to customized sizes
  • Thin and lightweight
  • Heat resistant up to 600°C
  • RoHS compliant

Areas of Application

  • Semiconductor device testing, e.g. CPU, GPU, MCM, etc
  • Mobile phones & PC tablets, PCs, Servers and cloud storage
  • PDP, LED devices, IGBT Modules
  • Optical communications equipment, medical equipment

Specifications

DescriptionUnitLVM-700 SpecificationsTest Method
Part Number-LVM-700-40-GISLVM-700-70-GIS-
Composition-GaInSnZnGaInSnZnNA
Volatility%<0.001<0.001ASTM DE595
Thermal Conductivity (Z-plane)W/mK4070ASTM D5470
ConductivityS/m8x10^68x10^6-
ViscositymPa·s42004200-
Operating Temperature-50~600-50~600EN344

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